MANUAL | STANDARD OPERATING PROCEDURE

GENERAL INFORMATION
Chemical Mechanical Polishing is the process of planarizing thin films using gentle removal of material by both physical and chemical means. The CMP is located at the back end inside the clean room. Polishing of 4" wafers (both standard thickness and 400um thick) and 1x1cm2 pieces is possible. Other chip-size templates can be ordered by individual groups and stored in the cleanroom. Celexis and Klebosol slurries for STI and ILD applications, respectively, are available.

For more information please contact the clean room staff at: cniCR@columbia.edu.

Tool superuser: Shriddha Chaitanya