GENERAL INFORMATION | OPERATING INSTRUCTIONS
The Edwards/BOC Thermal Evaporator is available to use after a user interface upgrade and automation. This evaporator is used for the deposition of F-RIE compatible metals (Au and Cu free), mainly for hard mask applications. The evaporator vacuum is obtained using a direct drive mechanical pump and turbomolecular pump; ultimate vacuums attained are in the mid 10-7 torr range. The deposition rate is monitored by a calibrated frequency thickness monitor. Resistive thermal evaporation is the most commonly used metal deposition technique. It consists of vaporizing a solid material (pure metal) by heating it to sufficiently high temperatures and recondensing the material onto a cooler substrate to form a thin film. The heating is carried out by passing a large current through a filament container (tungsten boat or material coated tungsten rod), which has a finite electrical resistance.

CONTACT INFORMATION
For additional information about the Edwards/BOC Thermal Evaporator, please contact the clean room staff at: cniCR@columbia.edu.